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1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc8110 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. home appliances applications dip 4pin high speed under high load resistance photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow soldering) 3. high speed response at turn-off time due to built-in schottky barrier diode (at saturation mode) 4. high isolation voltage between input and output (v iso(rms) : 5kv) 5. lead-free and rohs directive compliant description pc8110xnsz0f series contains an ired optically coupled to a phototransistor built-in schottky barrier diode. it is packaged in a 4-pin dip, and smt gullwing lead-form option. input-output isolation voltage(rms) is 5.0kv. ctr is 50% to 400% at input current of 5ma. 1 sheet no.: d2-a03802en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc8110xnsz0f series pc8110xnsz0f series
internal connection diagram anode cathode emitter collector 1 1 3 4 5 2 4 3 schottky barrier diode 2 sheet no.: d2-a03802en outline dimensions (unit : mm) 1. through-hole [ex. pc8110xnsz0f ] 2. smt gullwing lead-form [ex. pc8110xniz0f ] 8110 rank mark factory identification mark date code 4.58 0.5 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.5 anode mark 7.62 0.3 4.58 0.5 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 : 0 to 13? epoxy resin 0.26 0.1 1 2 4 3 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark rank mark factory identification mark date code 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 8110 pc8110xnsz0f series product mass : approx. 0.22g product mass : approx. 0.23g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actural status of the production. 3 repeats in a 20 year cycle sheet no.: d2-a03802en rank mark refer to the model line-up table pc8110xnsz0f series
sheet no.: d2-a03802en electro-optical characteristics parameter conditions forward voltage reverse current terminal capacitance collector dark current transfer charac- teristics collector current collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance floating capacitance min. ? ? ? ? 2.5 ? 5 10 10 ? ? ? typ. 1.2 ? 30 ? ? ? 0.15 10 11 0.6 3 2 max. 1.4 10 250 100 ? 20 0.35 ? 1.0 20 10 unit v v a pf na ma v ? pf ? 213 ? 950 ? 23 90 s ? 313 ? 10 50 ? 27 100 symbol v f i r c t i ceo bv ceo i c v ce (sat) c f t r t f t on t s t off t on t s t off r iso not saturated saturated 1 saturated 2 response time rise time fall time turn-on time storage time turn-off time turn-on time storage time turn-off time input output i f = 20ma v r = 4v peak forward voltage ?? 3.0 v v fm i fm = 0.5a v = 0, f = 1khz v ce = 50v, i f = 0 i c = 0.1ma, i f = 0 i f = 5ma, v ce = 5v dc500v, 40 to 60%rh v ce = 2v, i c = 2ma, r l = 100 ? v cc = 5v, i c = 20ma, r l = 10k ? v cc = 5v, i c = 20ma, r l = 100k ? v = 0, f = 1mhz i f = 20ma, i c = 1ma 70 (t a = 25?c) *4 *4 the collector-emitter voltage has negative resistance characteristics since this device has built-in base-emitter resistor. therefore, please be careful not to provide the voltage that goes beyond absolute maximum ratings. absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 50 1.0 70 reverse voltage v v r 6 70 0.1 30 150 200 ? 30 to + 100 ? 55 to + 125 260 5.0 kv 4 pc8110xnsz0f series
sheet no.: d2-a03802en model line-up i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) with or without rank mark a 2.5 to 20.0 3.0 to 6.0 through-hole smt gullwing 100pcs/sleeve 100pcs/sleeve b 5.0 to 10.0 c 7.5 to 15.0 a or b 3.0 to 10.0 b or c 5.0 to 15.0 a, b or c 3.0 to 15.0 pc81102nsz0f pc81101nsz0f pc81100nsz0f pc81103nsz0f pc81105nsz0f pc81106nsz0f PC81108NSZ0F pc81100niz0f pc81101niz0f pc81102niz0f pc81103niz0f pc81105niz0f pc81106niz0f pc81108niz0f pc81100nip0f pc81101nip0f pc81102nip0f pc81103nip0f pc81105nip0f pc81106nip0f pc81108nip0f 2000pcs/reel lead form package model no. 5 please contact a local sharp sales representative to inquire about production status. pc8110xnsz0f series
sheet no.: d2-a03802en forward current i f (ma) 1 100 10 01 3 2 forward voltage v f (v) t a = 25?c t a = 75?c t a = 100?c t a = 50?c t a = 0?c t a = ? 25?c fig.6 forward current vs. forward voltage peak forward current i fm (ma) duty ratio pulse width 100 s t a = 25?c 10 1 000 100 10 ? 2 10 ? 3 10 ? 1 1 fig.5 peak forward current vs. duty ratio forward current i f (ma) ambient temperature t a (?c) 0 50 40 30 20 10 ? 30 0 25 50 55 75 100 125 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 30 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature 6 total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 pc8110xnsz0f series
sheet no.: d2-a03802en collector dark current i ceo (a) ambient temperature t a (?c) ? 30 100 90 80 70 60 50 40 30 20 10 0 ? 10 ? 20 v ce = 50v 10 ? 11 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 fig.11 collector dark current vs. ambient temperature response time ( s) 0.1 100 110 100 load resistance r l (k ? ) v cc = 5v i f = 20ma t a = 25?c t s 10 1 t off t on fig.12 response time vs. load resistance (saturation region) relative current transfer ratio (%) ambient temperature t a (?c) ? 30 100 90 80 70 60 50 40 30 20 10 0 ? 10 ? 20 v ce = 5v i f = 5ma 0 140 120 100 80 60 40 20 fig.9 relative current transfer ratio vs. ambient temperature collector-emitter saturation voltage v ce (sat) (v) ambient temperature t a (?c) 0 0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 i f = 20ma i c = 1ma ? 30 100 90 80 70 60 50 40 30 20 10 0 ? 10 ? 20 fig.10 collector - emitter saturation voltage vs. ambient temperature 7 current transfer ratio ctr (%) forward current i f (ma) 110 100 0 200 160 120 80 40 180 140 100 60 20 v ce = 5v t a = 25?c fig.7 current transfer ratio vs. forward current collector current i c (ma) collector-emitter voltage v ce (v) 0 30 0246810 t a = 25?c 25 20 15 10 5 p c (max.) i f = 30ma i f = 20ma i f = 10ma i f = 5ma i f = 3ma fig.8 collector current vs. collector-emitter voltage pc8110xnsz0f series
sheet no.: d2-a03802en fig.13 response time vs. load resistance (active region) remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 voltage gain a v (db) ? 25 5 0.1 1 10 100 1 000 frequency response f (khz) v ce = 2v i c = 2ma t a = 25?c 0 ? 5 ? 10 ? 15 ? 20 r l = 10k ? 1k ? 100 ? fig.15 frequency response collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 5 0510 15 t a = 25?c 4 3 2 1 i c = 7ma i c = 5ma i c = 3ma i c = 1ma i c = 0.5ma fig.16 collector-emitter saturation voltage vs. forward current fig.14 test circuit for response time response time ( s) 0.1 100 0.1 1 10 load resistance r l (k ? ) v ce = 2v i c = 2ma t a = 25?c t f t r t d t s 10 1 pc8110xnsz0f series 10% input output input output 90% t s t d v cc r d r l t f t r please refer to the conditions in fig.12 and fig.13 v ce
sheet no.: d2-a03802en design considerations while operating at i f <5.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. the collector-emitter voltage has negative resistance characteristics since this device has built-in base-emit- ter resistor. therefore, please be careful not to provide the voltage that goes beyond absolute maximum ratings. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 2.2 2.54 1.7 8.2 (unit : mm) design guide pc8110xnsz0f series
sheet no.: d2-a03802en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc8110xnsz0f series
sheet no.: d2-a03802en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 11 pc8110xnsz0f series
sheet no.: d2-a03802en sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions package specification 12 (unit : mm) 12.0 6.7 5.8 10.8 520 2 pc8110xnsz0f series
sheet no.: d2-a03802en 13 tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc8110xnsz0f series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 14 sheet no.: d2-a03802en [e202] important notices pc8110xnsz0f series

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